@article{oai:iwate-u.repo.nii.ac.jp:00010025,
 author = {水野, 雅裕 and 井山, 俊郎 and 浜田, 智和 and 庄司, 克雄 and 厨川, 常元},
 issue = {2},
 journal = {砥粒加工学会誌},
 month = {Mar},
 note = {There are several problems in the micro-route grinding of ceramics with electroplated diamond quill: fracture of
quill, elastic deformation of quill, dulling of the cutting grain edges, large roughness of the cut-off surface and so on. These all come from the thinness of the quill. For the purpose of solving these problems, cutoff experiments were carried out under two kinds of grinding conditions. One was under oscillating workpiece in the spinde axis direction and the other was under swinging the spindle in its axis direction. The experimental results are summarized as follows. (1)Under no oscillation of workpiece, the grinding force doesn't decrease with the reduction of the
tabl speed. (2)When oscillating workpiece, the grinding force becomes remarkably small with the increase of workpiece frequency if the table speed is small. (3)However, the effect of workpiece oscillation becomes small when the table speed is high. (4)The roughness of cut-off surface is improved by increasing the workpiece frequency. (5)When swinging the spindle at low frequency and in large amplitude, the roughness of cut-off surface in the table feed direction becomes large because of the cyclic changing of the tool deformation.},
 pages = {95--100},
 title = {ダイヤモンドクイルによるマイクロルート研削に関する研究},
 volume = {38},
 year = {1994}
}